钻石赞助 | 晟光硅研邀您参加第五届亚太碳化硅及相关材料国际会议

尊敬的业内同仁，您好！

西安晟光硅研半导体科技有限公司诚挚地邀请您参加11月6日-8日在中国深圳·深圳坪山格兰云天国际酒店举办的第五届亚太碳化硅及相关材料国际会议。

在会议期间，西安晟光硅研半导体科技有限公司作为钻石赞助，将在VIP05展台上展出最新产品和技术，我们诚挚地邀请您莅临展台，与我们进行深入的交流和探讨，共同探索合作与发展的可能性。

Distinguished delegates，

Xi' an LaSiC Semiconductor Technology Co.,Ltd .sincerely invite you to participate in the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)！

APCSCRM 2024 will be grandly held in Grand Skylight International Hotel Shenzhen Pingshan, China, on November 06-08, 2024, for better accelerating the academic rese

arch, technological progress and industrial upgrading of silicon carbide and other wide bandgap semiconductor industries in the Asia-Pacific region.

During the conference, Xi' an LaSiC Semiconductor Technology Co.,Ltd . as a diamond sponsor, will exhibit the latest products and technologies on booth VIP05. We sincerely invite you to visit our booth for in-depth exchanges and discussions, and explore the possibilities of cooperation and development together.

我们是一家充满活力与创新精神的互联网公司，致力于为全球用户提供最先进、最便捷的科技产品与服务。

公司成立于2021年2月，企业研发中心位于西安航天基地；公司主要从事微射流激光先进技术设备的研发和制造，设备主要面向半导体材料、航空航天、特种金属、多层复材客户；在加工效率、加工质量等方面优势明显，新型技术方案的推出，给广泛的特种材料加工市场带来全新的思考和变革。

公司是国内第一家完全实现商用化微射流激光先进技术设备的研发/制造企业，已通过数家国内典型客户、多个领域的验证并获得订单，全面进入批量应用前工艺匹配阶段

The company was estabished in Febnany 2021 , and the enterprise R&D center is located at the Xi'an Aerospace Base. The company is mainly engaged in the rescarch and manufacturing of advanced technology equipment for microjet laser, which customers is mainly aimed at aerospace composite materials, special metals, semiconductor materials, and multi-layer composite customers;The advantages in processing efficiency, processing quality, and other aspects are obvious. The launch of new technological solutions has brought new thinking and transformation to the extensive special materials processing market.

一、微射流激光技术

LASER MICROJET(LMJ)

聚焦激光束耦合进高速水射流，在水柱内壁发生全反射后形成截面能量均匀分布的能量束。兼备微射流激光低线宽、能量密度大、方向可控、加工深度长、实时降低加工材料表面温度等特性，为硬脆材料一体化高效精加工，提供绝佳条件。

微射流激光技术利用了激光在水和空气的界面上发生全反射的原理，使激光耦合在稳定的水射流内部，利用水射流内部很高的能量密度来实现材料的去除其基本原理，如下图所示。

自主阶梯式激光微射流加工专利技术实现低损耗、高效率的材料切割和磨抛一体化精简工艺流程，降低切割材料损耗，提高企业利润。

The focused combines a hair-thin liquid Microjet with a high power laserbeam, the laser beam is guided inside the liquid jet by total internal reflection, andbecoming an energy beam with uniformly distributed cross sectional energy.lt combines thecharacteristics of low linewidth, high energy density, controllable direction, longprocessing depth, and real-time reduction of material surface temperature of microjetlaser,The microjet laser technology provides excellent conditions for integrated andefficient precision machining of hard and brittle materials.

The microjet laser technology utilizes the principle of total reflection of laser at theinterface between water and air, coupling the laser inside a stable water jet andutilizing the high energy density inside the waterjet to achieve material removal. Thebasic principle is shown in the following figure.

The patented technology of autonomous stepped laser micro jet machining achieves low lossand high efficiency in material cutting and grinding, simplifying the process flow,reducing cutting material loss, and improving enterprise profits.

碳化硅晶舟制备

Preparation of silicon carbide crystal boat

碳化硅异型切割

Silicon denomorphous cutting

打孔

Punching

金刚石切片

Diamond slice

二、部分案例分享

Some processing cases

钛棒超深制孔

uper deep diameter titanium rod through the core hole

高温合金制孔

Superalloy-through/blind holes

陶瓷基复合材料切割

Ceramic matrix composite ⸺ round cut/square cut

磁性材料通孔/盲孔

Ferrite magnetic material——through hole/blind hole

西安晟光硅研半导体科技有限公司

Xi' an LaSiC Semiconductor Technology Co.,Ltd .

邮箱/Email：342110757@qq.com

电话/Tel:

029-85936713

公司地址/Address:

陕西省西安市国家民用航天产业基地航天南路中国电科西安产业园6号楼3楼东侧

East side of 3rd Floor, Building 6, China Electric Xian Industrial Park, Aerospace South Road, National Civil Aerospace Industry Base, Xi 'an, Shaanxi Province

一、会议名称/Conference：

“芯时代开放创新·芯机遇合作发展”--第五届亚太碳化硅及相关材料国际会议

Open·lnnovation·Collaborative· Development——the 5th Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2024)

二、时间地点/Date&Venue：

时间：2024年11月6日—11月8日

地点：中国·深圳，深圳坪山格兰云天国际酒店

Date: Nov.6th,2024--Nov.8th,2024

Venue: Grand Skylight International Hotel Shenzhen Pingshan & Yanzi Lake International Convention and Exhibition Center

Location: No.36 Ruifing Road, Pingshan District, Shenzhen, Guangdong, China

三、组织机构/Organization：

四、会议安排/Schedule

五、赞助单位/Sponsors：

六、会议官网/Website：

七、报名参会/Registration：

Scan to Register

八、会务联系/Contact:

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